[ICOM] Loose parts
MikeR
nf4l at nf4l.com
Wed Feb 2 13:57:40 EST 2005
Hi Woody -
I think you're right. At a closer examination, it looks like the bright
plating on the spring peeled. Wonder if there's anytning under or
attached to the square "can" that would be damaged by the heat of
soldering? I don't see an easy way to remove it, short of taking out the
board (shudder) it's mounted on. Still speculating on it's importance.
Thanks,
Mike
Woody wrote:
> Hi Mike:
>
> The spring should be soldered to the metal shield shown in your photo. The brown "stuff" is most likely solder flux instead of glue.
>
> 73,
>
> Woody
> KJ4SO
> ----- Original Message -----
> From: MikeR
> To: ICOM Reflector
> Sent: Wednesday, February 02, 2005 1:07 PM
> Subject: [ICOM] Loose parts
>
>
> I picked up the PRO II to do some cleaning. When I let it go vertical, I
> heard something loose in the case. I took the bottom cover off, and
> discovered a spring loose. It appears to have been cemented to another
> component, and used as a ground contact against the bottom cover.
> Pix at http://nf4l.com/pro_ii.htm
> How important is this piece, and how best to re-attach it?
> Thanx!
> Mike NF4L
>
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