[R-390] Ping Tests and Solder

[Scott Overstreet]

I don't know just what all this "Ping Testing" is about but just in case it 
is in some way important that I respond-----be it known that I did.

And---

63/37 solder is entectic and hence most fluid right up to the point of 
solidifing where as 60/40, belive it or not, goes through a viscosity 
thickning as it cools into solidification. 50/50 which isn't used much in 
electrical work has an even wider temperature range in which it thickenes as 
it cools---They all have their place in application.

Kester "44" flux is the old standby and is my choice for most electrical 
work ----its very "active" and washes off nicely with alcohol.

Scott