[NJARC] Tin Whiskers

[Mbeeferman at cs.com]

In a message dated 10/6/2007 8:11:59 PM Pacific Daylight Time, al at ar88.net 
writes: 
> Yes, this is the result of the same Al-Gore tree-hugging junk science 
> that has the insulation falling off the space shuttle, killing 
> astronauts, because they didn't want to use freon to make the foam any 
> more. Tin "dendrite" growth was a major concern in electronics back in 
> the '70's and we got it largely under control. Now they're surprised 
> that changing the solder to almost all tin causes a problem. Duh!!!
> 
> Al
> 
I not quite sure it's under control...perhaps for present production but not 
for relatively recent examples where the damage was already done.  Agreed that 
dendrite growth requires certain unique conditions, but it still remains a 
problem with past production examples.   My company has dealt with numerous 
certified (pictures) examples of board and component failures extending well 
beyond the 70's.  Microscopic examination is now a requirement for material 
undergoing repair.