[Elecraft] Source of poor solder joints?

[Stuart Rohre]

Wiping the tip (clean iron tip, well tinned) before each joint is made when 
doing pads and wetting the tip with the tip of the wire solder are key 
steps.  Touch the tip with fresh solder just before starting to solder the 
joint.  Apply the solder wire to the junction of the lead, pad, and iron 
tip. Hold steady until you see full wetting action, then get the heated tip 
off the joint in a smooth motion.

Also, use smaller diameter solder when you are doing just a pin of a active 
IC/ transistor, larger solder when doing shield can soldering, etc.  Make 
the solder fit the work.

Proper heat and tip size has been mentioned.  A high intensity light for 
older eyes and a lighted magnifier make inspection of each joint a faster 
process.  The light helps insure you got solder all around a pad, wire lead, 
device lead, etc.

Practice with a heat controlled iron, or a smaller constant wattage iron, 
makes perfect solder joints.  Inspection though, is still needed just in 
case you get in a hurry.  Check the tightness of your element and tip before 
you fire up the iron.

Stop working when you are tired, or eyesight gets fuzzy.  Don't rush an 
assembly job.

Check off each step, read it first, understand before you do anything. 
Double check that you have the right value part, check off each step after 
inspecting the joints and the parts used in that step.

Read the manuals through before starting a kit.  Clarify any unclear points. 
This forum is very helpful as there are a lot of experienced builders of the 
same units here as the one you may be assembling.

GL and 73,
Stuart
K5KVH