[Elecraft] Soldering iron tip temperature for KPA100

[Lyle Johnson]

> A more common case is "lifting the pad" which occurs when the copper+tin
> plating on the board expands and overcomes the adhesive bond
> which holds it to the board.

It was pointed out to me that this may not be the mechanism for the failure.
It could be that the adhesive simply breaks down at high temperature.

> This results because the pad was allowed to reach
> too high of a temperature.

But this is in fact the cause.

Enjoy!

Lyle