[ARC5] Scope Question

[Kenneth G. Gordon]

On 21 Mar 2018 at 14:31, J Mcvey via ARC5 wrote:

> Some of the BGA components fail not because of the silicon, but because the 
> solder connections crack. Reflowing them will sometimes restore operation, but is 
> not always reliable. They actually need to be removed, cleaned and re-balled- but 
> who wants to do that?

OK. Educate me here: first what is a BGA component? And secondly, what does "reballed" 
mean?

Ken W7EKB

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